for solar wafering silicon carbide powder

1.Solar and semiconductor wafer wire sawing 2.High-grade SiC lump supplied by our own smelting plant 3.High purity SiC 99.02%

 Main features:

Crystal structure, high hardness and strong cutting ability, stable chemical characteristics, good thermal conductivity.

Main applications:

Solar adn semiconductor wafer wire sawing; crystal and ferrite polishing; ceramic and special steel precision polishing; bonded and coated abrasive tools; cutting and polishing; non-ferrous metal lapping such as glass, stone, agate and high-grade jewelry; high-grade refractory materials, engineering ceramic; heating elements and thermal elements.

Detaied specifications:

F.C%	0.04
SiC%	99.02
Fe2O3%	0.14
D3	14.54~14.64
D50	10.23~10.25
D94	6.82~6.96
Bulk Density(g/cm3)	1.65
PH	7.31~7.52

for solar wafering silicon carbide powder